Ansys RedHawk-SC is a preeminent software solution in the semiconductor industry, recognized as the "gold standard" for power integrity and reliability sign-off in System-on-Chip (SoC) designs. As integrated circuits (ICs) continue to shrink to advanced process nodes like 3nm and beyond, the challenges associated with power delivery, noise, and reliability become increasingly complex. RedHawk-SC addresses these critical issues by providing comprehensive multiphysics simulation capabilities, ensuring that chip designs are robust, performant, and reliable before manufacturing.
At its core, RedHawk-SC is built upon Ansys SeaScape, a custom-designed, big data architecture specifically engineered for electronic system design and simulation. This cloud-native platform provides unparalleled scalability, elastic compute capabilities, and advanced analytics, allowing engineers to handle the immense data volumes and computational demands of modern SoC designs. It facilitates rapid data mining, enabling swift identification of potential weaknesses and proactive optimization of power and performance.
Ansys RedHawk-SC is designed to tackle the intricate power integrity and reliability challenges inherent in modern IC designs. Its comprehensive suite of features ensures that chips can operate efficiently and dependably under various conditions.
The primary function of RedHawk-SC is to perform power integrity and reliability sign-off. This crucial step in the semiconductor development lifecycle involves validating that a design will function as expected once manufactured. Errors at this stage can lead to costly revisions, potentially exceeding $10 million for advanced chip designs. RedHawk-SC helps mitigate these risks by providing accurate pre-silicon analysis.
The software offers comprehensive dynamic analysis coverage, supporting various simulation modes, including RTL and gate vectors, smart vectorless analysis, mix-mode simulation, and frequency-aware vectorless analysis to stress system-level power delivery networks (PDNs), power-transients, and power-up sequences.
Beyond core power integrity, RedHawk-SC extends its capabilities to address complex multiphysics interactions essential for advanced packaging and security.
For complex 2.5D/3D IC systems, Ansys RedHawk-SC Electrothermal offers an advanced option that concurrently solves electrical, thermal, and mechanical coupling interactions. This is crucial for multi-die packages where the interplay between electrical power delivery, heat dissipation, and mechanical stress significantly impacts overall system performance and reliability. It can analyze up to a billion instances, providing detailed insights into signal integrity (SI) effects within the package interconnects by extracting RC parasitics across the entire 3D stack.
An illustrative view of the Ansys RedHawk-SC analysis interface, demonstrating power integrity simulations for complex chip designs.
In an increasingly security-conscious world, RedHawk-SC Security stands as the EDA industry's first pre-silicon hardware security solution. It identifies side-channel leakage vulnerabilities, which can be exploited to extract sensitive data like cryptographic keys. By performing multiphysics simulations of power consumption, power noise, and electromagnetic emissions from the layout's RTL, it predicts potential leakage before manufacturing, allowing designers to implement countermeasures and enhance hardware security.
A defining feature of RedHawk-SC is its foundation on Ansys SeaScape, a purpose-built big data architecture. This architecture enables:
RedHawk-SC seamlessly integrates with all major Electronic Design Automation (EDA) implementation flows and other Ansys tools, such as Ansys Path FX (for variability-aware timing analysis) and Ansys PathFinder (for electrostatic discharge analysis). Furthermore, it leverages machine learning capabilities to automate time-consuming manual procedures and identify systematic design weaknesses by aggregating insights from continuous and prior simulation data.
To better understand the multifaceted strengths of Ansys RedHawk-SC, let's consider a comparative analysis across several key performance and feature dimensions. The radar chart below visually represents its capabilities in areas vital for modern SoC design and verification.
This radar chart illustrates the superior capabilities of Ansys RedHawk-SC compared to a typical legacy power integrity tool. RedHawk-SC excels in areas such as Power Integrity Accuracy, Electromigration Reliability, and Scalability due to its cloud-native architecture. While legacy tools might offer basic functionalities, they often fall short in advanced areas like Security Analysis, comprehensive Big Data Analytics, and seamless integration with modern EDA flows. RedHawk-SC's strength lies in its holistic approach, covering a broader spectrum of critical design and verification needs with higher precision and efficiency.
Ansys RedHawk-SC is indispensable for companies designing complex SoCs for various markets, including mobile, communications, high-performance computing (HPC), and automotive. Its robust analysis capabilities ensure that these critical components are power-efficient and reliable, mitigating risks related to thermal, electromigration, and electrostatic discharge (ESD) issues.
The software’s ability to conduct full-chip analysis with high speed and capacity makes it particularly valuable for advanced process nodes (down to 3nm), where design complexities are immense and validation is paramount for first-time silicon success.
The table below summarizes the key features of Ansys RedHawk-SC and the benefits they provide to IC designers and verification engineers.
Feature Category | Specific Feature | Benefit to Users |
---|---|---|
Power Integrity Analysis | Full-chip IR Drop Analysis (Static & Dynamic) | Identifies voltage fluctuations across power delivery networks, preventing performance degradation and functional failures. |
Electromigration (EM) Analysis | Predicts and mitigates long-term reliability issues due to current-induced material degradation in interconnects. | |
Timing Impact of IR-Drop | Assesses how voltage drops affect timing, ensuring designs meet performance specifications. | |
Reliability Analysis | Thermal Reliability Analysis | Identifies and manages thermal hotspots, crucial for maintaining chip performance and longevity. |
Electrothermal Co-simulation (2.5D/3D ICs) | Analyzes coupled electrical, thermal, and mechanical interactions in complex multi-die systems. | |
Cloud & Scalability | Cloud-Native Elastic Compute (Ansys SeaScape) | Enables rapid, scalable analysis of massive chip designs by distributing workloads across many CPU cores. |
Low Memory Footprint per Worker | Optimized for cloud deployment, requiring less than 32GB per worker CPU, reducing infrastructure costs. | |
Advanced Analytics | Big Data Analytics & Machine Learning Support | Facilitates rapid data mining, identifies design weaknesses, and automates optimization processes. |
Vectored and Vectorless Activity Analysis | Provides comprehensive coverage for dynamic power supply noise identification by exploring various switching scenarios. | |
Hardware Security | Side-Channel Leakage Analysis (RedHawk-SC Security) | Predicts and quantifies hardware vulnerabilities to side-channel attacks pre-silicon, enhancing chip security. |
Integration & Collaboration | Integration with Major EDA Flows | Seamlessly fits into existing design environments, working with other Ansys tools and third-party solutions. |
Multi-site Collaboration Support | Enables distributed teams to view, debug, and explore design and simulation data concurrently. |
To further contextualize Ansys RedHawk-SC's role and capabilities, consider the "Introducing ANSYS RedHawk-SC" video. This video provides an excellent overview of the software's architecture and its benefits for achieving design success in advanced SoC power noise sign-off.
"Introducing ANSYS RedHawk-SC" provides an in-depth look at how the software addresses the challenges of advanced SoC designs, particularly concerning power noise and reliability at sub-16nm nodes. It highlights the integration with the SeaScape platform and its implications for elastic compute and big data analytics, reinforcing RedHawk-SC's position as a critical tool for achieving silicon success.
Ansys RedHawk-SC stands as a cornerstone in the semiconductor industry for ensuring the power integrity and reliability of modern System-on-Chip designs. Its cloud-native, big data architecture, powered by Ansys SeaScape, enables unparalleled scalability and efficiency, addressing the complex challenges of advanced process nodes. From comprehensive IR drop and electromigration analysis to sophisticated electrothermal co-simulation for 2.5D/3D ICs and pioneering hardware security verification, RedHawk-SC provides designers with the trusted tools necessary for first-time silicon success and robust product performance in an increasingly demanding technological landscape. Its ability to combine accuracy with high capacity and rapid analysis positions it as an indispensable solution for navigating the complexities of next-generation chip development.